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MEAM Seminar: “Engineering Interfaces To Improve The Thermal Performance of Wide Bandgap Semiconductors”

February 23 at 10:30 AM - 12:00 PM

Wide bandgap electronics are currently under development due to their potential to create some of the most advanced RF and power electronics in the world. A key concern in their development is the control of the junction temperature during operation which is impacted by the internal device thermal resistance. To address this concern, we will discuss advancements in thermal characterization techniques that have allowed new insights into the role of material interfaces on the thermal response of electronic devices made from GaN, AlGaN, and Ga2O3. While combining these semiconductors with high thermal conductivity like AlN, SiC or diamond have promise for improving heat dissipation, manufacturing challenges exist that must be addressed. We will discuss a few of these methods of integration ranging from direct growth to plasma activated bonding. Finally, for power electronics, packaging solutions for the thermal management of ultrawide bandgap devices will be presented, allowing for the future implementation of this technology.

Samuel Graham

Eugene C. Gwaltney, Jr. School Professor and Chair, Woodruff School of Mechanical Engineering, Georgia Institute of Technology

Samuel Graham is the Eugene C. Gwaltney, Jr. Professor and Chair of the Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. He leads the Electronics Manufacturing and Reliability Laboratory which is focused on the electrical and thermal characterization, packaging, and reliability of wide bandgap semiconductors, solar cells, and flexible electronics. He also holds a courtesy appointment in the School of Materials Science and Engineering at Georgia Tech, a joint appointment with the National Renewable Energy Laboratory, and is a Visiting Professor at Nagoya University in Nagoya, Japan. He is a Fellow of ASME, a member of the Engineering Sciences Research Foundation Advisory Board of Sandia National Laboratories, and the Emerging Technologies Technical Advisory Committee for the US Department of Commerce.

Details

Date:
February 23
Time:
10:30 AM - 12:00 PM
Event Category:
Event Tags:

Venue

Zoom – Email MEAM for Link
peterlit@seas.upenn.edu

Organizer

Mechanical Engineering and Applied Mechanics
Phone:
215-746-1818
Email:
meam@seas.upenn.edu
Website:
http://www.me.upenn.edu/